کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4971485 1450527 2017 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
چکیده انگلیسی
The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 73, June 2017, Pages 69-75
نویسندگان
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