Isothermal bending fatigue response of solder joints in high power semiconductor test structures

Fatigue and cyclic delamination behavior of PbSnAg solders which are typically used as die attach material in power semiconductors was investigated. Isothermal bending fatigue tests were performed by using multilayered model test structures consisting of Si chips soldered on ceramic substrates and failure probability curves were obtained up to 1e8 loading cycles. The fatigue experiments were conducted by using an ultrasonic fatigue testing machine equipped with a three point bending set-up at a constant testing temperature of 80 °C. Detailed failure analysis of the fatigued samples revealed a dependency of the failure mode on the chemical composition of the high-Pb soft solders. The main failure modes included interfacial delamination of the Si-chip from the die attach, degradation due to crack propagation in the solder layer and in some cases partial fracture of the chip. Finally the feasibility of high frequency mechanical fatigue testing for screening and evaluation of solder joints in multilayered electronic systems is discussed.