Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 411, 31 July 2017, Pages 82-90

Jing Xiang, Chong Wang, Yuanming Chen, Shouxu Wang, Yan Hong, Huaiwu Zhang, Lijun Gong, Wei He,