Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration

Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 403, 1 May 2017, Pages 525-530

Junqiang Wang, Qian Wang, Zijian Wu, Lin Tan, Jian Cai, Dejun Wang,