Keywords: ادغام سه بعدی; Thermal management; Network-on-chip; System-on-chip; Manycore processors; 3D integration;
مقالات ISI ادغام سه بعدی (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: ادغام سه بعدی; Multi-core architectures; Network-on-Chip; 3D Integration;
Keywords: ادغام سه بعدی; Si thinning; Grinding; Wafer to wafer; 3D integration; Dielectric bonding; Subsurface damage;
Keywords: ادغام سه بعدی; Adhesive wafer bonding; Ultra-thin bonding layer; 3D integration; MEMS; NEMS; Photonics;
Keywords: ادغام سه بعدی; 3D integration; Wafer-on-wafer; Ultra-thinning; Grinding damage; Cu contamination; Positron annihilation;
Keywords: ادغام سه بعدی; Network-on-chip; Temperature; 3D integration; Resource sharing;
Keywords: ادغام سه بعدی; Interfaces; Nickel microcones; 3D integration; Low-temperature bonding; Electrodeposition
Keywords: ادغام سه بعدی; Hybrid bonding; Single-micron pitch; Non-conductive film; Chemical mechanical polishing; Underfill; 3D integration;
Keywords: ادغام سه بعدی; TSV; TSV manufacturing; TSV backside grind process; TSV reliability; TSV testing; 3D integration;
Keywords: ادغام سه بعدی; TSV; Supercritical-CO2; Emulsion; Nickel electroplating; 3D integration; Packaging
Keywords: ادغام سه بعدی; Williams syndrome; Low-gamma oscillations; 3D integration; Visual coherence; EEG/ERP;
Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations
Keywords: ادغام سه بعدی; Scanning acoustic microscopy; Through silicon vias; 3D integration; Rayleigh waves; Elastodynamic finite integration technique; Acoustic simulation; Failure detection; Metallization;
Impact of TSV location in HVIC on CMOS operation: A mixed-mode TCAD simulation study
Keywords: ادغام سه بعدی; 0.35â¯Î¼m BiCMOS technology; 3D integration; Smart power; Through Silicon Vias (TSV); TCAD;
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
Keywords: ادغام سه بعدی; 3D integration; Direct bonding; Hybrid bonding; Finite element analysis; Roughness; Material modeling;
A novel wet etching based double-sides interposer structure with deep trenches for 3-D hetero-integration
Keywords: ادغام سه بعدی; 3D integration; Silicon interposer; Anisotropic wet etching; Trench;
New insights on SOI Tunnel FETs with low-temperature process flow for CoolCube⢠integration
Keywords: ادغام سه بعدی; Tunnel FET; TFET; SOI; Low temperature; SPER; Tunnelling; BTBT; 3D integration;
3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for charged particle detection
Keywords: ادغام سه بعدی; Avalanche pixel; Coincidence; SPAD; Charged particle detection; 3D integration;
3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars
Keywords: ادغام سه بعدی; 3D imaging; 3D integration; Copper pillars; X-ray tomography; Slice and view; Synchrotron;
Dielectrics stability for intermediate BEOL in 3D sequential integration
Keywords: ادغام سه بعدی; 3D integration; Dielectrics; Thermal stability; Outgassing;
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Keywords: ادغام سه بعدی; Intermetallic voids; Kirkendall voids; Reliability; 3D integration; X-ray diffraction; Time-of-flight mass spectroscopy;
Monolithic technology for silicon nanowires in high-topography architectures
Keywords: ادغام سه بعدی; Silicon nanowire; 3D integrated circuit; 3D integration; Top-down fabrication; Trench isolation;
A wet etching approach for the via-reveal of a wafer with through silicon vias
Keywords: ادغام سه بعدی; 3D integration; Through silicon via; Interposer; Wet etch; Backside reveal;
Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration
Keywords: ادغام سه بعدی; 3D integration; low temperature Cu-Sn bonding; Plasma pretreatment; Self-assembled monolayer (SAM);
Revisiting 3DIC benefit with multiple tiers
Keywords: ادغام سه بعدی; 3D integration; Power and area benefits; Infinite dimension;
Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications
Keywords: ادغام سه بعدی; Bonding; Temporary; Adhesive; 3D integration; Adherence;
Thermomechanical finite element modeling of Cu-SiO2 direct hybrid bonding with a dishing effect on Cu surfaces
Keywords: ادغام سه بعدی; 3D integration; Direct bonding; Finite element analysis; Cohesive model; Nonlinear contact mechanics;
Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C
Keywords: ادغام سه بعدی; Cu/adhesive hybrid bonding; Surface activation; H-containing HCOOH vapor treatment; Surface activated bonding; 3D integration;
The direct growth of carbon nanotubes as vertical interconnects in 3D integrated circuits
Keywords: ادغام سه بعدی; Carbon nanotubes; Integrated circuits; Interconnects; Transistors; CMOS; 3D integration; Chemical vapour deposition;
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration
Keywords: ادغام سه بعدی; 3D integration; Through silicon via (TSV); Transmission line; Electrical measurement; RF characterization
UTBB FDSOI: Evolution and opportunities
Keywords: ادغام سه بعدی; FDSOI; Thin Body; Thin BOX; Back biasing; IoT; Sensors; 3D integration;
Electrical characterisation of InGaAs on insulator structures
Keywords: ادغام سه بعدی; InGaAs; 3D integration; Interlayer dielectric;
Minimized program disturb for vertically stacked junctionless charge-trapping flash memory devices by adopting in-situ doped poly-silicon channel
Keywords: ادغام سه بعدی; In-situ doped; Program disturb; Junctionless; Charge-trapping (CT) flash; 3D integration;
Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics
Keywords: ادغام سه بعدی; Cu bonding; Plasma treatment; Metal surface; Ar plasma; 3D integration;
Experimental characterization of coaxial through silicon vias for 3D integration
Keywords: ادغام سه بعدی; 3D integration; Through silicon vias; RF; Millimeter-wave
Thermo-mechanical characterization of passive stress sensors in Si interposer
Keywords: ادغام سه بعدی; Stress sensors; 3D integration; Finite element analysis; Electrical measurements
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence
Keywords: ادغام سه بعدی; Electromigration; In operando characterization; 3D interconnects; Reliability; 3D integration
3D sensors and micro-fabricated detector systems
Keywords: ادغام سه بعدی; 3D silicon sensor; MEMS; 3D integration; ATLAS pixel upgrade; LHC upgrade; FE-I4; Pixels; Radiation hardness. Micro-channel-cooling; 3D printing;
Status and perspectives of pixel sensors based on 3D vertical integration
Keywords: ادغام سه بعدی; CMOS; Readout electronics; Pixel detectors; 3D integration;
Through Silicon Capacitor co-integrated with TSVs on silicon interposer
Keywords: ادغام سه بعدی; TSC; Decoupling capacitor; MIM; Silicon interposer; 3D integration; Packaging
Deep sub micrometer imaging of defects in copper pillars by X-ray tomography in a SEM
Keywords: ادغام سه بعدی; Nanotomography; X-ray; 3D integration; Copper pillar; SEM; Plasma FIB;
Architecture level optimization of 3-dimensional tree-based FPGA
Keywords: ادغام سه بعدی; 3D Integration; Tree-based FPGA; Placement; Partitioning; Routing; Butterfly-fat-tree
Low-temperature solid state bonding method based on surface Cu-Ni alloying microcones
Keywords: ادغام سه بعدی; 3D integration; Low-temperature bonding; Cu-Ni microcones; Bonding strength; Interfaces; Diffusion;
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
Keywords: ادغام سه بعدی; 3D integration; Diffusion barrier; Reliability; Physical-vapor deposition; Thermal stability; Through-Silicon via (TSV)
Optimal placement of vertical connections in 3D Network-on-Chip
Keywords: ادغام سه بعدی; 3D integration; Network-on-Chip; Through Silicon Via; Resource placement; Chip Multiprocessor
Efficient routing techniques in heterogeneous 3D Networks-on-Chip
Keywords: ادغام سه بعدی; Networks-on-Chip; 3D integration; Performance evaluation
Wafer warpage analysis of stacked wafers for 3D integration
Keywords: ادغام سه بعدی; Wafer stacking; Warpage; Cu bonding; Coefficient of thermal expansion; 3D integration
Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
Keywords: ادغام سه بعدی; Lock-in thermography; Phase shift analysis; Thermal defect localization; Integrated circuits; Microelectronic devices; 3D integration
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
Keywords: ادغام سه بعدی; Through Silicon Via (TSV); 3D integration; Metallization
Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias
Keywords: ادغام سه بعدی; 3D integration; Infrared imager; SWIR focal plane; Silicon on insulator
Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking
Keywords: ادغام سه بعدی; 3D integration; Silicon substrate; Through Silicon Vias (TSV); Capacitive, conductive and inductive coupling; Microwave