Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 414, 31 August 2017, Pages 163-170

Ran He, Masahisa Fujino, Masatake Akaike, Taiji Sakai, Seiki Sakuyama, Tadatomo Suga,