Substrate material affects wettability of surfaces coated and sintered with silica nanoparticles

► We coated silica nanoparticles on glass, polyimide and copper substrates at different concentrations and performed a thermal sintering process for nanoparticles immobilization. ► We examined the surface morphologies and surface elements of above mentioned substrates. ► We examined the surface wettability of the above mentioned substrates. ► Copper surface has a significantly greater contact angle than the other two substrates at the same nanoparticles concentrations. ► Nano-roughening of copper surface due to thermal sintering helps to develop hierarchic micro/nanostructures, and is believed contribute to the wettability difference. Such nano-roughened features were not found in glass/polyimide substrates. ► Substrate material and the surface preparation approach must be appropriately selected by considering the possible surface topography evolution during surface functionalization and subsequent use.