کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5358460 | 1388232 | 2010 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition](/preview/png/5358460.png)
چکیده انگلیسی
Copper thin film on silane modified poly(ethylene terephthalate) (PET) substrate was fabricated by ultrasonic-assisted electroless deposition. The composition and topography of copper plating PET films were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and atomic force microscopy (AFM), respectively. Peel adhesion strength, as high as 16.7Â N/cm, was achieved for the planting copper layer to the modified PET substrate with ultrasonic-assisted deposition; however, a relative low value as 11.9Â N/cm was obtained for the sample without ultrasonic vibration by the same measurement. The electrical conductivity of Cu film was changed from 7.9Â ÃÂ 104 to 2.1Â ÃÂ 105Â S/cm by using ultrasonic technique. Ultrasonic operation has the significant merits of fast deposition and formation of good membranes for electroless deposition of Cu on PET film.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 256, Issue 11, 15 March 2010, Pages 3554-3558
Journal: Applied Surface Science - Volume 256, Issue 11, 15 March 2010, Pages 3554-3558
نویسندگان
Yinxiang Lu,