کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5359268 1388245 2011 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Influence of jet-to-substrate distance on plasma etching of polyamide 6 films with atmospheric pressure plasma
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Influence of jet-to-substrate distance on plasma etching of polyamide 6 films with atmospheric pressure plasma
چکیده انگلیسی
In this study, polyamide 6 films were treated with different jet-to-substrate distances to investigate how it influenced the etching effect of plasma treatment. When the samples were too close or too far from the nozzle, the etching rate was almost not measurable. When the distance was 2 mm, the etching rate was larger than that of other distance. Decrease in contact angle was observed under 2 mm or 3 mm of jet-to-substrate distance. However, the contact angle had no change when jet-to-substrate distance was 1 mm or 6 mm. It can be seen that the peel strength increased when jet-to-substrate distance was 2 mm or 3 mm, and the peel strength was the largest when jet-to-substrate distance was 2 mm. However, the peel strength had no change when jet-to-substrate distance was 1 mm or 6 mm. These results were corresponding to SEM and XPS results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 257, Issue 7, 15 January 2011, Pages 2531-2535
نویسندگان
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