Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

► Deposit thin Ni-Co-P alloy layers with different concentration of Ni, Co and P on the silicon substrate. ► Use complete wet process for the diffusion barrier alloy deposition. ► The barrier properties degraded with increasing the concentration of Co i.e. decreasing the P. ► The lower Co and higher P contents alloy film act as a good diffusion barrier up to 500 °C.