کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5361828 1388277 2011 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating
موضوعات مرتبط
مهندسی و علوم پایه شیمی شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
Laser induced activation of circuit lines and via-holes on AlN for electroless metal plating
چکیده انگلیسی
► The research results on fine lines show the relations between the quality of copper metallization and laser wavelengths, energy density, repetition rate and repetition. ► Metallic aluminium produced by decomposition of AlN on local laser irradiated surfaces is proven with the XPS data and is seen to be the electron supplier and catalyzing center for electrochemical reactions in electroless copper bath. ► Blind, through-hole and V-shaped micro via-holes show depth-dependent activation and metallization.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 257, Issue 15, 15 May 2011, Pages 6601-6606
نویسندگان
, , ,