Preparation of fluorocarbon thin film deposited by soft X-ray ablation and its electrical characteristics and thermal stability

Fluorocarbon films were deposited by soft X-ray ablation of polytetrafluoroethylene (PTFE) and characterized as low-dielectric-constant interlayer dielectrics. Very rapid deposition of such films at approximately 1500 nm/min could be achieved at room temperature. Fourier-transform infrared spectroscopy (FT-IR) measurement results suggest that the films deposited are primarily formed as one-dimensional chains of (-CF2-)n which are partially cross-linked. The cross-link density increases with increasing deposition temperature, which improves the thermal stability. However, the dielectric constant of the films increased abruptly above 300 °C. The dielectric constant and leakage current at 1.0 MV/cm of the film deposited at room temperature were approximately 2.1 and 2.0×10−9 A/cm2, respectively.