Keywords: ثابت دی الکتریک پایین; Polyimide aerogel; Trifluoromethyl group; Low dielectric constant; Moisture-resistant; Absorption capacity;
مقالات ISI ثابت دی الکتریک پایین (ترجمه نشده)
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Keywords: ثابت دی الکتریک پایین; Cross-linking; Low dielectric constant; Anti-moisture; Co-polyimide; Tetrafluorostyrol side-group;
Keywords: ثابت دی الکتریک پایین; Halloysite; Intercalation; Crystalline structure; Low dielectric constant; Organosilicone hybrid film;
Keywords: ثابت دی الکتریک پایین; 64.75 Xc; 68.05.-n; 68.18 Fg; 68.18-g; 68.47 Pe; 77.84.Nh; 82.70 Dd; 82.70.Kj; Oil-oil interfaces; Interfacial activity; Low dielectric constant; Particle-laden interfaces; Water-free emulsions;
Keywords: ثابت دی الکتریک پایین; Polyimide; Low dielectric constant; Organosoluble; Triphenyl methane; Synthesis;
Keywords: ثابت دی الکتریک پایین; Polyetherimide; Thin films; Thermal properties; Low dielectric constant; Conductivity; Gas permeation;
Keywords: ثابت دی الکتریک پایین; Low-k films; Porous silica; Tetrapropylammonium hydroxide; Low dielectric constant
Keywords: ثابت دی الکتریک پایین; Borazine; Low dielectric constant; Arylacetylene
Comparison of O2 plasma treatment on porous low dielectric constant material at sidewall and bottom of trench structure
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Porous dielectric; O2 plasma; Trench; Reliability; Time-dependent-dielectric-breakdown;
Low-dielectric-constant LiAlO2 ceramics combined with LBSCA glass for LTCC applications
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Microwave dielectric properties; LTCC; LBSCA; LiAlO2;
Crystal structure and microwave dielectric properties of CaTiO3 modified Mg2Al4Si5O18 cordierite ceramics
Keywords: ثابت دی الکتریک پایین; Microwave dielectric ceramic; Silicate; Mg2Al4Si5O18; Low dielectric constant
Symmetry of hexagonal ring and microwave dielectric properties of (Mg1−xLnx)2Al4Si5O18+x (Ln = La, Sm) cordierite-type ceramics
Keywords: ثابت دی الکتریک پایین; Microwave dielectric ceramics; Silicate; Mg2Al4Si5O18; Low dielectric constant
Phase composition and microwave dielectric properties of SrTiO3 modified Mg2Al4Si5O18 cordierite ceramics
Keywords: ثابت دی الکتریک پایین; Microwave dielectric ceramics; Silicate; Mg2Al4Si5O18; Low dielectric constant;
New fluorinated xanthene-containing polybenzoxazoles with low dielectric constants
Keywords: ثابت دی الکتریک پایین; Fluorinated polybenzoxazoles; Xanthene cardo group; One-pot solution procedure; Low dielectric constant; Improved solubility;
Synthesis and properties of poly(aryl ether sulfone)s incorporating cage and linear organosiloxane in the backbones
Keywords: ثابت دی الکتریک پایین; Poly(aryl ether sulfone)s; Organosiloxane; Low dielectric constant;
Improved dielectric and mechanical properties of silica/epoxy resin nanocomposites prepared with a novel organic–inorganic hybrid mesoporous silica: POSS–MPS
Keywords: ثابت دی الکتریک پایین; Mesoporous silica; Polyhedral oligomeric silsesquioxane; Nanocomposites; Low dielectric constant; Thermal properties; Mechanical properties
Narrow gap filling in 25 nm shallow trench isolation using highly porous organosilica
Keywords: ثابت دی الکتریک پایین; Mesoporous silica; Organosilica; Low dielectric constant; Vapor phase synthesis; Shallow trench isolation; Patterning
Low dielectric constant nanoporous silica/PMMA nanocomposites with improved thermal and mechanical properties
Keywords: ثابت دی الکتریک پایین; Periodic mesoporous organosilicas; Poly(methyl methacrylate); Nanocomposites; Low dielectric constant; Mechanical properties; Thermal properties;
Temperature dependent electrical impedance spectroscopy measurements of plasma enhanced chemical vapour deposited linalyl acetate thin films
Keywords: ثابت دی الکتریک پایین; Plasma enhanced chemical vapour deposition; Linalyl acetate; Electrical impedance spectroscopy; Low dielectric constant; Relaxation time distribution
Solution processed SiNxCyOz thin films thermally transformed from silicon oxide/melamine hybrid system
Keywords: ثابت دی الکتریک پایین; Sol–gel reaction; Low dielectric constant; Solution-processable; Silicon-based thin films; Hardness
Dielectric properties of parylene AF4 as low-k material for microelectronic applications
Keywords: ثابت دی الکتریک پایین; Parylene; Fluoropolymer; Low dielectric constant; Dielectric spectroscopy; Dielectric relaxation;
Microstructure developments of F-doped SiO2 thin films prepared by liquid phase deposition
Keywords: ثابت دی الکتریک پایین; Microstructure; Dielectric materials; Dielectric properties; Silica; Chemical solution deposition; Nanoparticulates; Low dielectric constant; Fluorine; Doped silicon dioxide
Synthesis of hydrophobic mesoporous silica films using poly(dimethylsiloxane)–poly(ethylene oxide) (PDMS–PEO) as co-template
Keywords: ثابت دی الکتریک پایین; Mesoporous silica films; Poly(dimethylsiloxane)–poly(ethylene oxide); Hydrophobic properties; Low dielectric constant; Lamellar structure
Deposition characterization of low-k hybrid thin films using methyl methacrylate for ULSI applications
Keywords: ثابت دی الکتریک پایین; MMA incorporation; Low dielectric constant; CV analyzer
Method to predict effective dielectric constant of porous silica low dielectric constant materials
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Porous materials; Fractal
Sol–gel deposited SiO2 and hybrid low dielectric constant thin films
Keywords: ثابت دی الکتریک پایین; HCl; HF catalyst; Hybrid thin film; Low refractive index; Low dielectric constant
Infrared spectroscopic analysis of siloxane network modification of mesoporous silica film by silylation and cesium doping
Keywords: ثابت دی الکتریک پایین; Low Dielectric Constant; Porous Silica; Mesoporous Silica; Fourier Transform Infrared Spectroscopy; Silica; Silylation;
Influence of oxygen plasma treatment on boron carbon nitride film composition
Keywords: ثابت دی الکتریک پایین; Ashing; Interconnection; Low-k; BCN; Low dielectric constant; O2 plasma; XPS;
Increasing mechanical strength of mesoporous silica thin films by addition of tetrapropylammonium hydroxide and refluxing processes
Keywords: ثابت دی الکتریک پایین; Low-k film; Mesoporous; Silica; Mechanical strength; Reflux; Tetrapropylammonium hydroxide (TPAOH); Low dielectric constant
Effect of etching on dielectric constant and surface composition of SiCOH low-k films in inductively coupled fluorocarbon plasmas
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Fluorocarbon plasma; FT-IR; XPS; AES; ICP-CVD etcher
High Tg and high organosolubility of novel polyimides containing twisted structures derived from 4-(4-amino-2-chlorophenyl)-1-(4-aminophenoxy)-2,6-di-tert-butylbenzene
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Polyimide; Solubility; High Tg
Characterization of BCN film after wet process for interconnection integration
Keywords: ثابت دی الکتریک پایین; BCN; LowK; Low dielectric constant; Interconnection; Wet process; XPS; FTIR
Synthesis and properties of soluble fluorinated poly(ether imide)s with different pendant groups
Keywords: ثابت دی الکتریک پایین; Fluorinated polyimides; Low dielectric constant; Optical properties;
Low dielectric constant silica films with ordered nanoporous structure
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Silica film; Ordered nanoporous;
Effect of Si–OH group on characteristics of SiCOH films prepared by decamethylcyclopentasiloxane electron cyclotron resonance plasma
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; SiCOH films; Structural properties; Plasma processing deposition
Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; SiCOH; Low-k; Diethoxymethylsiliane; DEMS;
Comparison of characteristics and integration of copper diffusion-barrier dielectrics
Keywords: ثابت دی الکتریک پایین; Barrier layer; Low dielectric constant; Adhesion strength; Capacitance
Preparation of fluorocarbon thin film deposited by soft X-ray ablation and its electrical characteristics and thermal stability
Keywords: ثابت دی الکتریک پایین; 77.55.+f; 79.20.La; 73.40.Qv; Fluorocarbon film; Polytetrafluoroethylene; Soft X-ray ablation; Low dielectric constant; Current-voltage characteristics; Thermal stability;
Heat, moisture and chemical resistance on low dielectric constant (low-k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; Diethoxymethylsilane; Organosilicate glass; Thermal stability
Highly optically transparent/low color polyimide films prepared from hydroquinone- or resorcinol-based bis(ether anhydride) and trifluoromethyl-containing bis(ether amine)s
Keywords: ثابت دی الکتریک پایین; Fluorinated polyimides; Low color; Low dielectric constant;
Effects of acetylene addition on mechanical and dielectric properties of amorphous carbon films
Keywords: ثابت دی الکتریک پایین; Acetylene; Plasma processing and deposition; Low dielectric constant
Synthesis and characterization of porous silsesquioxane dielectric films
Keywords: ثابت دی الکتریک پایین; 77.55.+f Dielectric thin films; 81.07 .âb Nanoscale materials and structures: fabrication and characterization; 78.55. Mb porous materials; Silsesquioxane; Low dielectric constant; Nanoscale materials; Synthesis and characterization; Porous materials;
Effect of oxygen plasma treatment on low dielectric constant carbon-doped silicon oxide thin films
Keywords: ثابت دی الکتریک پایین; Low dielectric constant; PE-CVD; Oxygen plasma; Thin film; Dielectrics;
Study of the morphologies and dielectric constants of nanoporous materials derived from benzoxazine-terminated poly(ε-caprolactone)/polybenzoxazine co-polymers
Keywords: ثابت دی الکتریک پایین; Polybenzoxazine; Nanoporous; Low dielectric constant;