کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
540027 871284 2010 15 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Thermal modeling and analysis of 3D multi-processor chips
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Thermal modeling and analysis of 3D multi-processor chips
چکیده انگلیسی

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that build the 3D stack. Moreover, the floorplanning of the chip strongly determines the thermal profile of the system and a quick exploration of the design space is required to minimize the damage of the thermal effects.This paper proposes a complete thermal model for 3D-CMPs with building nano-structures. The proposed thermal model is then used to characterize the thermal behavior of the Niagara system and expose the strong influence of the chip floorplanning in the thermal profile.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Integration, the VLSI Journal - Volume 43, Issue 4, September 2010, Pages 327–341
نویسندگان
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