کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
540027 | 871284 | 2010 | 15 صفحه PDF | دانلود رایگان |

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold. These thermal-aware policies require the envision of high-level models that capture the complex thermal behavior of (nano)structures that build the 3D stack. Moreover, the floorplanning of the chip strongly determines the thermal profile of the system and a quick exploration of the design space is required to minimize the damage of the thermal effects.This paper proposes a complete thermal model for 3D-CMPs with building nano-structures. The proposed thermal model is then used to characterize the thermal behavior of the Niagara system and expose the strong influence of the chip floorplanning in the thermal profile.
Journal: Integration, the VLSI Journal - Volume 43, Issue 4, September 2010, Pages 327–341