کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
541727 871487 2014 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
An analytical subthreshold current modeling of cylindrical gate all around (CGAA) MOSFET incorporating the influence of device design engineering
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
An analytical subthreshold current modeling of cylindrical gate all around (CGAA) MOSFET incorporating the influence of device design engineering
چکیده انگلیسی


• The analytical model is developed using super position technique.
• GC–GS with high metal work function exhibits minimum sub threshold characteristics.
• Reduced DIBL and subthreshold slope has been measured in combined design.
• Proper optimization of doping profile significantly reduces DIBL effect.
• Effectiveness of applying the three region doping profile concept in the channel has been examined.

An analytical model of CGAA MOSFET incorporating material engineering, channel engineering and stack engineering has been proposed and verified using ATLAS 3D device simulator. A comparative study of short channel effects for various device structures has also been carried out incorporating the effect of drain induced barrier lowering (DIBL), threshold voltage lowering and degradation of subthreshold slope. The effectiveness of applying the three region doping profile concept in the channel such as high-medium-low and low-high-low and its comparison with Gaussian doping profile to the cylindrical GAA MOSFET has been examined in detail. Reduced SCEs have been evaluated in combined designs i.e. TM–GC–GS, GCGS and DM–GC–GS. Out of several design engineering, GC–GS CGAA gives nearly ideal subthreshold slope whereas TM–GC–GS CGAA provides overall superior performance to reduce SCEs in deep nano-meter. The results so obtained are in good agreement with the simulated data which validate the model.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 45, Issue 4, April 2014, Pages 408–415
نویسندگان
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