کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
541786 871493 2013 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Evaluation of thermal transient characterization methodologies for high-power LED applications
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Evaluation of thermal transient characterization methodologies for high-power LED applications
چکیده انگلیسی

In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance RthJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called “point of separation” of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 44, Issue 11, November 2013, Pages 1005–1010
نویسندگان
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