Growth and alloying of thin film Te on Cu(111)

► XPS, UPS, LEED and STM investigation into the surface structure of Te/Cu(111) ► Below 0.33 ML Te coverage, (2 √3 × √3) R30° surface substitutional alloy is formed. ► Above 0.66 ML and even for thick films a stable alloy forms which is consistent with the unusual F4̅3m Cu3Te2 phase. ► Alloying is kinetically limited below 260 K.