Transient distributed parameter electrical analogous model of TE devices

This paper describes a one-dimensional distributed parameter transient model for thermoelectric devices implemented using analogies between the thermal and electrical domains, where thermal variables are described by their electrical analogues. The resulting electrical network can be tested by means of an electrical simulation tool such as SPICE. This approach facilitates simulation of a thermoelectric module and its interconnections with electronic control circuits and other thermal elements under varying boundary and initial conditions. Capabilities of the model are illustrated from simulations carried out for a free-standing thermoelectric element during the pulse cooling operation. Simulation results fit well with those obtained using other models reported in the literature as well as with numerical solutions.