کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5437245 | 1509798 | 2017 | 20 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Removal mechanism of sapphire substrates (0001, 112¯0 and 101¯0) in mechanical planarization machining
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Removal mechanism of sapphire substrates (0001, 112¯0 and 101¯0) in mechanical planarization machining Removal mechanism of sapphire substrates (0001, 112¯0 and 101¯0) in mechanical planarization machining](/preview/png/5437245.png)
چکیده انگلیسی
The mechanical planarization machining of sapphire substrates including the C- (0001), A- (112¯0), and M- (101¯0) orientations with the sol-gel (SG) polishing pad has been performed in this paper. The polishing results show that the C-orientation with a surface roughness about 2 nm is smoother than the A- and M-orientations, and the material removal rate (MRR) of C-orientation is higher than that of them. The removal mechanism of sapphire substrate was investigated by the wear debris and subsurface structure through transmission electron microscopy (TEM). And the instrumented nanomechanical tests were applied to further reveal the removal mechanism by nanoindentation. The analysis results indicate that the variation tendency of MRRs depends on the crystalline structure and nanomechanical properties of sapphire substrates. In addition, the processing of sapphire substrates is mainly dominated by the mechanical removal sapphire material during mechanical planarization machining.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ceramics International - Volume 43, Issue 18, 15 December 2017, Pages 16178-16184
Journal: Ceramics International - Volume 43, Issue 18, 15 December 2017, Pages 16178-16184
نویسندگان
Qiufa Luo, Jing Lu, Xipeng Xu, Feng Jiang,