Multi-layer microstructure fabrication by combining bulk silicon micromachining and UV-LIGA technology

A novel method for fabrication of multi-layer microstructures of microelectro-mechanical system (MEMS) devices is described. This technique, which combines bulk silicon micromachining technique and UV-LIGA technique can overcome some shape limitations of single technique on complex microstructures. To demonstrate this combination, the SU-8 microstructure fabricated in the etched silicon grooves is presented. In this fabrication process, a SU-8 removal method by fuming sulfuric acid was introduced and a novel type of plastics PETG was tried in microhot embossing process. The proposed fabrication process can be applied to fabricating a high-aspect-ratio microstructure for a large displacement actuator and precision sensors. Moreover, this combined process enables the fabrication of more complex structures, which cannot be fabricated by bulk micromachining or UV-LIGA alone.