کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5443753 1510875 2017 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
چکیده انگلیسی
The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. As shown in the figures below, the Sn grains on the right-hand side transformed into IMCs; however, the grain on the left-hand side had less IMC formation due to large angle between c-axis of Sn grain and electron flow.60
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 128, February 2017, Pages 6-9
نویسندگان
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