کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5443753 | 1510875 | 2017 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. As shown in the figures below, the Sn grains on the right-hand side transformed into IMCs; however, the grain on the left-hand side had less IMC formation due to large angle between c-axis of Sn grain and electron flow.60
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 128, February 2017, Pages 6-9
Journal: Scripta Materialia - Volume 128, February 2017, Pages 6-9
نویسندگان
Yu-An Shen, Chih Chen,