Microstructural transformation and thermo-mechanical improvement of quinary Bi-Sn-In-Ga-Zn solder bumps on a flexible PET substrate

Microstructural transformation and thermo-mechanical improvement of quinary Bi-Sn-In-Ga-Zn solder bumps on a flexible PET substrate

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: B - Volume 224, October 2017, Pages 93-102

Sang Hoon Kim, Younggyun Nam, Haengna Lee, Sunhwa Back, Min-soo Park, Gwang Joo Jang, Joon-Phil Choi, Clodualdo Jr.,