کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545519 1450554 2009 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Comparing drop impact test method using strain gauge measurements
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Comparing drop impact test method using strain gauge measurements
چکیده انگلیسی

In this paper, strain gauges are used to measure the dynamic response during drop impact. A set of high-speed data acquisition system is used to capture the real-time strain response of critical locations. Finite Element Modelling is used to determine where to place the strain gauges. Two board level drop impact test methods, A and B, are compared by the strain gauge measurements. Results show significant differences in strain amplitude, strain rate, frequency, rebound, and damping. Method B produces higher strain amplitude, stronger rebound, and less damping, while method A produces higher frequency and strain rate. Damping and rebound are important factors for both test methods. The differences of two test methods are due to the contributions from test condition and test board. Combination test were conducted to investigate the contribution of test condition and test board. Results show that test board dominates strain amplitude, frequency, mode and damping, while test condition shows influence on strain amplitude and rebound. Test condition A produces higher strain amplitude, while test condition B produces stronger rebound. Test board A produces higher frequency, while test board B produces higher strain amplitude and less damping. Test board contributes more to the strain amplitude than test condition. Strain rate is dependent on both the test condition and test board.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 49, Issues 9–11, September–November 2009, Pages 1299–1303
نویسندگان
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