کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
545524 1450554 2009 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Quasi hermetic packaging for new generation of spaceborn microwave equipment
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Quasi hermetic packaging for new generation of spaceborn microwave equipment
چکیده انگلیسی

This paper presents the introduction of the quasi hermetic encapsulation of microwave hybrids for space application through different approaches evaluated at Thales Alenia Space – France. Thanks to the improvement for many years of microwave organic materials, it is now realistic to propose advanced packaging solutions like the chip on board approach with glob top encapsulation of active devices directly bonded on printed circuit boards for space applications. To validate this packaging approach, very significant reliability test-plans have been proposed and performed on the different technological processes and materials in agreement with standard space quality requirements. Results will be presented and a discussion on the nature of the stresses applied during the tests will be proposed.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 49, Issues 9–11, September–November 2009, Pages 1326–1329
نویسندگان
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