An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

This work examines the thermal fatigue effects on different configurations of power modules used in harsh aeronautical environment. They are used in various applications where the temperature cycling due to the working environment is the most limiting fact. In this case, it is highlighted that the topology assembly choice is a critical point to reach the lifetime required for the final application. In addition, it is proposed to correlate the probabilistic finite elements calculus to the experimental accelerated ageing tests on test vehicle, in order to determine the best configuration of assembling stack consisting of baseplate/RoHS solder/metallized substrate.