کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
5455524 1514642 2017 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
ترجمه فارسی عنوان
تکامل و ریزساختار کروی و ریزساختار سربندهای سرب بر پایه اسن در فشار کم
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
چکیده انگلیسی
In this study, the viscoplastic creep behaviors of the Sn-4Ag/Cu, Sn-3Cu/Cu and Sn-58Bi/Cu solder joints under shear stress were in-situ observed, and the evolutions in microstructure of the solders were characterized by in-situ EBSD. The results reveal that the creep strain of the Sn-Cu and Sn-Ag solders increase linearly with increasing time. Deformation of the Sn-Cu solder concentrates in some parallel shear bands, while deformation of the Sn-Ag solder is relatively uniform, and the deformation concentration along the joint interface is not obvious for the two solders. The strain concentration around the fine Ag3Sn particles in the Sn-Ag solder is not obvious, while the strain concentration around the large Cu6Sn5 grain in the Sn-Cu solder is serious and result in fracture of the Cu6Sn5 grain. Dynamic high-temperature recovery occurs in the Sn-Ag and Sn-Cu solders, result in grain boundary migration, polygonization and formation of a few low-angle grain boundaries. The Sn-Bi solder deforms through grain boundary sliding and phase boundary sliding, the strain increase exponentially with increasing time, and its grain structure is stable during the deformation process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 701, 31 July 2017, Pages 187-195
نویسندگان
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