کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5456349 | 1514659 | 2017 | 28 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of ECAP processing on microstructure evolution and dynamic compressive behavior at different temperatures in an Al-Zn-Mg alloy
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effect of ECAP processing on microstructure evolution and dynamic compressive behavior at different temperatures in an Al-Zn-Mg alloy Effect of ECAP processing on microstructure evolution and dynamic compressive behavior at different temperatures in an Al-Zn-Mg alloy](/preview/png/5456349.png)
چکیده انگلیسی
An artificially aged Al-Zn-Mg alloy with a grain size of ~1.3 µm was processed by equal-channel angular pressing (ECAP) and then subjected to dynamic compression at a strain rate of 4000 sâ1 in the range from room temperature to 673 K. The results show the ηⲠphase is refined and a η phase is formed during the first pass of ECAP and after further processing 8 passes the GP zones are removed. An ultrafine-grained (UFG) structure with an average grain size of ~200 nm was obtained after 4 passes. It is shown that dynamic compressive deformation assists the precipitation process through precipitate coalescence and by changing the precipitate orientations. The dynamic compressive yield strengths and flow stresses decrease gradually to different degrees with increasing temperature except after ECAP processing for 4 passes where there is thermal stability up to 473 K. The ECAP processing significantly improves the strength of the alloy at elevated temperatures by comparison with the as-received material.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 684, 27 January 2017, Pages 617-625
Journal: Materials Science and Engineering: A - Volume 684, 27 January 2017, Pages 617-625
نویسندگان
Mohamed A. Afifi, Pedro Henrique R. Pereira, Ying Chun Wang, Yangwei Wang, Shukui Li, Terence G. Langdon,