کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
546333 871886 2011 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Power–thermal profiling of software applications
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Power–thermal profiling of software applications
چکیده انگلیسی

Power consumption and heat dissipation are becoming the major factors that limit the performance evolution of current state-of-the-art microprocessors. As they become key elements in the design of both high performance computers and battery powered devices, different power and thermal management strategies have been proposed and implemented during the last years in order to overcome this performance limitation. Considering that software applications have a large impact on power consumption and thermal map of the CPU cores, these design strategies tend to be addressed at higher levels even as they are usually implemented at lower levels of systems abstraction. The work presented in this paper evaluates the relation between power consumption and thermal response of CPU cores when different software applications are executed. The goal of this study is to identify how software applications can be used in thermal management process and whether it is feasible to implement thermal-aware software applications.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 42, Issue 4, April 2011, Pages 601–608
نویسندگان
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