کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5463741 | 1517202 | 2017 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always nucleated at Cu6Sn5/Cu interfaces and grew at the expense of the Cu6Sn5 phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu3Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu3Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu3Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu3Sn.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 186, 1 January 2017, Pages 283-288
Journal: Materials Letters - Volume 186, 1 January 2017, Pages 283-288
نویسندگان
H.Y. Zhao, J.H. Liu, Z.L. Li, Y.X. Zhao, H.W. Niu, X.G. Song, H.J. Dong,