کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5465238 | 1517573 | 2017 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Electroless Ni-P coating is helpful to improve the corrosion resistance and mechanical properties of the Al alloys. However, the electroless Ni-P plating is usually operated at higher temperature (above 80 °C, even up to 90 °C) in order to achieve appropriate deposition rate. Herein it is demonstrated that a novel Cu immersion layer on Al alloy with a hierarchical structure can significantly accelerate the electroless Ni-P process in a wide range of temperature. The hierarchically structured Cu layer is deposited on Al alloy through galvanic replacement deposition from an environment-friendly deep eutectic solvent comprising choline chloride and ethylene glycol. The hierarchical structure of Cu immersion layer strongly affects the nucleation and growth of Ni-P, which is beneficial for enhancing the deposition rate of electroless process. This protocol might be of interest in the fast fabrication of electroless Ni-P deposition on Al alloys at medium and low temperature (50 °C ~ 70 °C).
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 309, 15 January 2017, Pages 67-74
Journal: Surface and Coatings Technology - Volume 309, 15 January 2017, Pages 67-74
نویسندگان
Ruixue Kang, Zhenjun Peng, Baixing Liu, Daoai Wang, Jun Liang,