کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5467003 | 1398922 | 2017 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier](/preview/png/5467003.png)
چکیده انگلیسی
This paper presents a CMP process analysis considering an airbag type wafer carrier, which is used in semiconductor devices manufacturing. In the CMP process, a wafer is compressed against the polishing pad inside the wafer carrier, which consists of the retainer ring and the membrane film. Structural analysis model is developed to estimate contact pressure distribution over the wafer surface considering the airbag compression behaviour. The polishing experiment without wafer rotation indicated a unique pressure variation around the trailing edge of the wafer. The developed analysis estimated the same phenomena accurately and clarified the mechanism deteriorating the polishing pressure uniformity.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: CIRP Annals - Volume 66, Issue 1, 2017, Pages 329-332
Journal: CIRP Annals - Volume 66, Issue 1, 2017, Pages 329-332
نویسندگان
N. Suzuki, Y. Hashimoto, H. Yasuda, S. Yamaki, Y. Mochizuki,