کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5468112 | 1518927 | 2017 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Bipolar resistive switching behavior in Cu/AlN/Pt structure for ReRAM application
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سطوح، پوششها و فیلمها
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چکیده انگلیسی
Highly stable bipolar resistive switching behavior of Aluminum nitride (AlN) thin film sandwiched between Cu (Top) and Pt (bottom) electrode has been investigated. Resistive switching properties in Cu/AlN/Pt structure are induced by the formation/disruption of Cu conducting filaments in AlN thin film. Excellent non-volatile resistive switching characteristics have been observed at voltage of +2.6 V and â1.7 V. Trap controlled space charge limited current (SCLC) and ohmic behaviors are the dominant conduction mechanisms at high resistance state (HRS) and low resistance state (LRS) respectively. The resistance ratio corresponding to different HRS and LRS is found in the order of â¼104. Moreover, the device also showed an endurance till >104 cycles and a non volatile retention time for >104 s.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Vacuum - Volume 143, September 2017, Pages 102-105
Journal: Vacuum - Volume 143, September 2017, Pages 102-105
نویسندگان
Ravi Prakash, Davinder Kaur,