Influence of Ti content on the microstructure and properties of graphite flake/Cu-Ti composites fabricated by vacuum hot pressing

Graphite flake/Cu-Ti composites were successfully fabricated via vacuum hot pressing. The effects of Ti addition on the microstructure, bending strength and thermal conductivity (TC) were investigated. The results indicate that TiC interfacial layer was formed between the matrix and graphite flake in Ti-added composites, and the interfacial layer thickness initially sustains distinct growth and then turns into a faint increase with the increasing Ti content. The bending strength is proportional to the Ti content, exhibiting 60% increase by adding 2.0 wt% Ti as against the unmodified one. The thermal conductivity initially increases and then decreases with rising Ti content, yielding a maximum value of 597 W m−1 K−1 with 1.0 wt% Ti added. The graphite flake/Cu-Ti composites with moderate Ti addition showing excellent properties can be a highly attractive candidate for electronic packaging materials.