کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
546952 | 871959 | 2015 | 7 صفحه PDF | دانلود رایگان |
This work presents a thermal characterization approach for phase change materials thermal management systems (PCM-TMS) based on a thermal test device (TTD) allowing simultaneous dissipation and chip temperature measurement. The tests are oriented towards PCM-TMS characterization for their application in the power electronics domain, providing an insight to the physical phenomena involved in PCM systems. The PCM-TMS used in this work consists in a 35 mm diameter and 9.5 mm height Cu case, containing a 20 ppi porous Cu mesh and a 31 °C melting temperature paraffin. It has been demonstrated that the proposed characterization methodology is suitable for the assessment of this kind of non-linear systems, allowing an easy acquisition of both, heating and cooling transients.
Journal: Microelectronics Journal - Volume 46, Issue 12, Part A, December 2015, Pages 1195–1201