کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
547100 871977 2014 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Time scale matching of dynamically operated devices using composite thermal capacitors
ترجمه فارسی عنوان
تطابق مقیاس زمانی در دستگاه های پویا با استفاده از خازن های حرارتی کامپوزیت
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی

A new thermal management solution is proposed to maximize the performance of electronics devices with dynamically managed power profiles. To mitigate the non-uniformities in chip temperature profiles resulting from the dynamic power maps, solid–liquid phase change materials (PCMs) with an embedded heat spreader network are strategically positioned near localized hotspots, resulting in a large increase in the local thermal capacitance in these problematic areas. The resulting device, called composite thermal capacitor (CTC), can theoretically produce an up-to-twenty-fold increase in the time that a thermally constrained high heat flux device can operate before a power gating or core migration event is required. A prototype CTC that monolithically integrates micro heaters, PCMs and a spreader matrix into a Si test chip was fabricated and experimentally tested to validate the efficacy of the concept and to gain an insight into phase change heat transfer in a spatially-confined environment on the microscale. As the most significant result, an increase in allowable device operating times by over 7× has been experimentally demonstrated, while operating a device at heat fluxes approaching 400 W/cm2.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Journal - Volume 45, Issue 8, August 2014, Pages 1069–1078
نویسندگان
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