Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method

This paper is the ongoing research report and discusses important aspects of new investigation method selected for interconnects reliability and ageing which has to be considered in nano-scale. The research is ongoing and applies to heterogeneous device structures like SiP, SoC where mechanical stress caused by thermal cycling, heat dissipation, assembly technique etc. distributes inside thin layers of metal interconnects.