Effects of particle size of fiberglass-resin powder from PCBs on the properties and volatile behavior of phenolic molding compound

Fiberglass-resin powder (FR powder), a mixture of resin powder and glass fibers reclaimed from pulverized waste printed circuit boards (PCBs), is used as a partial substitute of wood flour in the production of modified phenolic molding compound (MPMC). The results show that incorporation of FR powder into MPMC as a filler enhances the thermal stability represented by heat deflection temperature (HDT). MPMC with FR powder smaller than 0.07 mm shows better properties, with a flexural strength of 73 MPa, a charpy notched impact strength of 3.0 kJ/m2, a HDT of 167 °C, and a dielectric strength of 3.7 MV/m, all of which meet the standard data. Thermogravimetric analysis shows that thermal degradation of MPMC mainly includes three steps, and over 55% weight loss of MPMC occurs between temperatures of 370 °C and 575 °C. Phenol is the main volatile compound released from molding powder during the production of molding product. After molding powder cures to molding product, low level of residual phenol is detected. All the results indicate that the MPMC can be used as a new type of molding compound.