کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
615956 1454860 2010 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
A phenomenological model of polishing of silicon with diamond abrasive
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی شیمی کلوئیدی و سطحی
پیش نمایش صفحه اول مقاله
A phenomenological model of polishing of silicon with diamond abrasive
چکیده انگلیسی
A phenomenological model of polishing hemispherical silicon asperities with spherical diamond abrasives is presented. Removal of the asperity material is quantitatively determined by a removal rate constant K. It is based on our molecular dynamics (MD) simulation studies considering the probability of removal of asperity atoms by an abrasive. The dependence of the removal rate constant K on the diameter and velocity of abrasives, number of asperities and abrasives per unit area, and cutting depth has been investigated. The rate constant K is found to be insensitive to the density of asperities, but linearly dependent on the density of abrasives.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Tribology International - Volume 43, Issues 1–2, January–February 2010, Pages 100-107
نویسندگان
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