کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
615956 | 1454860 | 2010 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A phenomenological model of polishing of silicon with diamond abrasive
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
شیمی کلوئیدی و سطحی
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چکیده انگلیسی
A phenomenological model of polishing hemispherical silicon asperities with spherical diamond abrasives is presented. Removal of the asperity material is quantitatively determined by a removal rate constant K. It is based on our molecular dynamics (MD) simulation studies considering the probability of removal of asperity atoms by an abrasive. The dependence of the removal rate constant K on the diameter and velocity of abrasives, number of asperities and abrasives per unit area, and cutting depth has been investigated. The rate constant K is found to be insensitive to the density of asperities, but linearly dependent on the density of abrasives.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Tribology International - Volume 43, Issues 1â2, JanuaryâFebruary 2010, Pages 100-107
Journal: Tribology International - Volume 43, Issues 1â2, JanuaryâFebruary 2010, Pages 100-107
نویسندگان
Paras M. Agrawal, R. Narulkar, S. Bukkapatnam, L.M. Raff, R. Komanduri,