کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6355195 | 1315032 | 2014 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid
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موضوعات مرتبط
مهندسی و علوم پایه
علوم زمین و سیارات
مهندسی ژئوتکنیک و زمین شناسی مهندسی
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چکیده انگلیسی
In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO4), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1-0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO4 can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Waste Management - Volume 34, Issue 2, February 2014, Pages 483-488
Journal: Waste Management - Volume 34, Issue 2, February 2014, Pages 483-488
نویسندگان
Jinxiu Huang, Mengjun Chen, Haiyan Chen, Shu Chen, Quan Sun,