کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6743165 | 1429325 | 2018 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructure and properties of W-Cu/CuCrZr/316L joint bonded by one-step HIP technique
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This work describes studies on the microstructure and properties of W-Cu/CuCrZr/316L joints bonded by one-step HIP technique. In the HIP process, both W-Cu/CuCrZr and CuCrZr/316L joints were connected simultaneously by diffusion bonding at 900â¯Â°C, 130â¯MPa for 2â¯h. Then for recovering the strength of CuCrZr alloy, heat-treatment process of solution annealing at 900â¯Â°C for 1â¯h which followed by water quench and aging treatment at 480â¯Â°C for 2â¯h were imposed on the HIPed module. After the heat treatment process, assessments on the microstructure, tensile test and Charpy impact test of the bonding joints were performed. Microstructural analysis showed that both the bonding joints were well welded and transition zones were observed along the interfaces of the joints. The microstructure of CuCrZr alloy was homogeneous with equiaxed grains and its mean grain size was around 42â¯Î¼m. Mechanical test showed that the bonding strength of CuCrZr/316L joint was considerably high with an impact toughness value of 104â¯Â±â¯2â¯J/cm2.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volume 128, March 2018, Pages 47-52
Journal: Fusion Engineering and Design - Volume 128, March 2018, Pages 47-52
نویسندگان
R. Wei, Q. Li, W.J. Wang, J.C. Wang, X.L. Wang, C.Y. Xie, G.-N. Luo,