کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6744108 | 1429329 | 2017 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Mechanical characterization of electrochemically based W - Cu joints for low-temperature heat sink application
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی انرژی
مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Mechanical characterization of electrochemically based W - Cu joints for low-temperature heat sink application Mechanical characterization of electrochemically based W - Cu joints for low-temperature heat sink application](/preview/png/6744108.png)
چکیده انگلیسی
Electrochemical plating was chosen as deposition technology for such reactive interlayers and demonstrators were processed with a 10 μm thick reactive Pd interlayer and joined by diffusion bonding. Their metallurgical behavior was characterized in dependence on processing temperature, reaction time and applied pressing load. The fabricated joints were mechanically qualified by shear testing. Cracking of the joints never appeared at the boundary of interlayer to W. The demonstrators revealed reasonable and applicable shear strength of around 100 MPa. The observed shear strength values and formed microstructures in the joining zone will be displayed and discussed in dependence on the applied processing parameters. The developed bonding process by applying electrochemically plated interlayers has proven to be a reliable tool with industrial application potential.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volume 124, November 2017, Pages 220-225
Journal: Fusion Engineering and Design - Volume 124, November 2017, Pages 220-225
نویسندگان
Wolfgang Krauss, Julia Lorenz, Jürgen Konys, Ermile Gaganidze,