کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6748667 | 1430213 | 2015 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A model for patterned interfaces debonding - Application to adhesion tests
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی عمران و سازه
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چکیده انگلیسی
Patterned interfaces are widely used in the industries of microelectronics and micro-electromechanical systems and are of general interest for obtaining specific interface properties by playing on geometry as an additional parameter influencing physical processes (interface engineering). In this paper, a novel analytical model is proposed to characterize the debonding of patterned interfaces. This model is accounting for both stretching and rotation of the finite width bond lines composing a patterning between two plain substrates. The model highlights how the choice of pattern periodicity and line width allows for controlling the interface mechanical behavior during debonding: presence of stable and unstable crack growth regimes. It is shown that models considering a continuum interface are to be used with care when dealing with patterned interfaces. The model proposed here, used in conjunction with an experimental procedure providing the sample bending profile during a wedge test (or a DCB test) should provide valuable guidance for determining the interface fracture energy Gc (mode I) for a patterned interface.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Solids and Structures - Volumes 75â76, 1 December 2015, Pages 122-133
Journal: International Journal of Solids and Structures - Volumes 75â76, 1 December 2015, Pages 122-133
نویسندگان
Coraly Cuminatto, Guillaume Parry, Muriel Braccini,