کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6748810 | 1430218 | 2015 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Finite element analysis of lithiation-induced decohesion of a silicon thin film adhesively bonded to a rigid substrate under potentiostatic operation
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی عمران و سازه
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Finite element analysis of lithiation-induced decohesion of a silicon thin film adhesively bonded to a rigid substrate under potentiostatic operation Finite element analysis of lithiation-induced decohesion of a silicon thin film adhesively bonded to a rigid substrate under potentiostatic operation](/preview/png/6748810.png)
چکیده انگلیسی
Insertion-induced stress and interfacial decohesion are studied for a silicon thin film adhesively bonded to a rigid substrate under potentiostatic operation. An axisymmetric finite element model with traction-separation law governing the interfacial degradation is used to study the highly nonlinear diffusion-induced volumetric expansion. Plastic yielding of the film, coupling effects between diffusion and stress, diffusion from both the edge and the top surfaces, and concentration dependence of material properties are considered. It is found interface fails in shear mode, and interfacial decohesion initiates at the interface corner and propagates toward the center. A smaller yield stress of the film is beneficial to structural integrity. The side surface and the top surface near the corner are the critical regions for fracture.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Solids and Structures - Volumes 67â68, 15 August 2015, Pages 263-271
Journal: International Journal of Solids and Structures - Volumes 67â68, 15 August 2015, Pages 263-271
نویسندگان
Ming Liu,