A momentum source model for wire-wrapped rod bundles-Concept, validation, and application

- A 3D momentum source model is developed for the wire-wrapped bundles.
- The concept is examined in 7 pin and 37 pin bundles steady state simulations.
- The validity of the model is confirmed by mesh and parameter sensitivity studies.
- The model is applied to transient simulations of a 61-pin EBR-II subassembly.
- Significant computing resources are saved with the developed MSM.