کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6942199 | 1450223 | 2018 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Contactless Heterogeneous 3-D ICs for Smart Sensing Systems
ترجمه فارسی عنوان
مدارهای سهبعدی هتروژنیک برای سیستمهای حساس هوشمند
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
چکیده انگلیسی
A heterogeneous contactless transceiver circuit is designed to provide inter-tier signalling for a 3-D system considering specific bonding constraints. The system is composed of two tiers, a 65â¯nm processing tier and a 0.35â¯Âµm sensing tier. Face-to-back integration is chosen to support fluidic sensing. Half duplex communication between the tiers is provided through inductive links. Each tier is considered to be fabricated in a different technology to enable low manufacturing cost and benefit from the advantages each technology offers. Both the uplink and downlink transceivers achieve data rates that reach 1â¯Gbps with non-return-to-zero data encoding. Energy efficiency is the predominant objective, with the uplink dissipating 5.28â¯pJ/b and 8.67â¯pJ/b for the downlink. A 6.8à power reduction is demonstrated when using heterogeneous technologies, compared to a state-of-the-art 0.35â¯Âµm transceiver, while the dissipated energy is decreased by 37.5% as compared to a state-of-the-art 65â¯nm transceiver. Process variation analysis is also performed to ensure the proposed circuit operates correctly across several process corners, covering a broad design space. To improve system robustness, an overhead of 2.3% on the peak power and <1% on the average power is shown, respectively.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Integration - Volume 62, June 2018, Pages 329-340
Journal: Integration - Volume 62, June 2018, Pages 329-340
نویسندگان
Ioannis A. Papistas, Vasilis F. Pavlidis,