Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly

The ability of conducting contact-free measurements is very important for small or low weight specimens. Bulky and heavy acceleration sensors add to much mass and change the deformation behaviour. Strain gages do not come with these drawbacks but require large mounting area and are difficult to mount reproducible. Using the contact-free measurement systems high spatial and time measurement resolution can be achieved. First experiments on solder joints of chip resistor components show the effect of temperature on solder joint damage under vibration loading. Increased temperatures increase the risk of vibration caused damage in SnAgCu solder joints.