Keywords: اتصالات جوش; Photovoltaic modules; Thermo-mechanical reliability; Fingers; Solder joints;
مقالات ISI اتصالات جوش (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: اتصالات جوش; Voids; Solder joints; Reliability; Moulded interconnect devices; Accelerated thermal cycling test; FEM modelling;
Keywords: اتصالات جوش; Fatigue; Fracture; Solder; Solder joints; Fatigue life prediction; Simulations; Peridynamics; FEA;
Keywords: اتصالات جوش; Sandwich assemblies; Bonded joints; Solder joints; Closed form; Interfacial stresses; Free edge;
Keywords: اتصالات جوش; Tin pest; Allotropic transformation; Lead-free solders; RoHS; Reliability; Risk; Solder joints;
Keywords: اتصالات جوش; Transmission X-ray microscopy; 3D μ-CT; Solder joints; Electromigration; Abnormal Cu depletion
Keywords: اتصالات جوش; Solder joints; Electronic assembly; Corrosion;
Keywords: اتصالات جوش; Solar cell assembly; Solder joints; Optimization; Thermo-mechanical reliability; Finite element method; Taguchi method;
Keywords: اتصالات جوش; Solder joints; Creep-fatigue; Unified model; Lifetime prediction; Acceleration factor; Catastrophic failures;
Keywords: اتصالات جوش; Free-edge; Thermal stresses; Bonding; Sandwiched structures; Discrete joints; Solder joints;
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Keywords: اتصالات جوش; Solder joints; Vibration; Temperature; Reliability; Experimental approach;
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
Keywords: اتصالات جوش; Solder joints; Carbon nanotubes (CNTs); Nanodoping; Intermetallic compounds (IMCs); Microstructure; Mechanical strength;
Effect of aging on mechanical properties of high temperature Pb-rich solder joints
Keywords: اتصالات جوش; High-Pb alloys; Mechanical properties; Solder joints; Intermetallics; Delamination; Reliability;
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
Keywords: اتصالات جوش; IMC layer; Thermo-mechanical excursion; Solder joints; Strain enhanced coarsening;
Reliability of SnAgCuFe Solder Joints in WLCSP30 Device
Keywords: اتصالات جوش; Anand model; solder joints; stress-strain; fatigue life;
New discovery of ZnO whisker in SnZn/Cu solder joints interconnection in concentrator silicon solar cells solder layer
Keywords: اتصالات جوش; ZnO whisker; Solder joints; Oxidation; Tensile stress;
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
Keywords: اتصالات جوش; Solder joints; High strain rate; Constitutive behavior; Leadfree; Life prediction
Vapour phase soldering used for quality improvement of semiconductor thermogenerators (TEGs) assembly
Keywords: اتصالات جوش; Semiconductor thermogenerators TEG; Vapour phase soldering; Voids; Solder joints
Properties and microstructures of SnAgCu-xEu alloys for concentrator silicon solar cells solder layer
Keywords: اتصالات جوش; Solar cell; Solder joints; Solderability; Creep life;
Frequency-dependent strain-life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency
Keywords: اتصالات جوش; Solder joints; Lead-free solder; Strain-life characteristic; Frequency dependent; High strain rate;
Wafer level package with thermal-stress-absorbing interface structure and elongated pad
Keywords: اتصالات جوش; Wafer level package; Interconnection reliability; Thermal-stress-absorbing interface; Solder joints; Elongated pad
A novel approach for flip chip solder joint inspection based on pulsed phase thermography
Keywords: اتصالات جوش; Flip chip; Solder joints; Inspection; Pulsed phase thermography
Damage predictions in a chip resistor solder joint on flexible circuit board
Keywords: اتصالات جوش; Damage; Solder joints; Computer modelling; Flexible circuit board; Thermal cycling
Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
Keywords: اتصالات جوش; Analytical solutions; Mechanical bending; Drop shock; Solder joints; Electronic packaging
High-G drop impact response and failure analysis of a chip packaged printed circuit board
Keywords: اتصالات جوش; Drop impact; High-G impact response; Solder joints; Impact failure/damage; FEM analysis
Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints
Keywords: اتصالات جوش; Sn-based solders; TMF; Internal stress; Solder joints
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
Keywords: اتصالات جوش; Constitutive modeling; Damage mechanics; Rate dependence; Integration scheme; Solder joints; Microelectronics packaging
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Keywords: اتصالات جوش; Lead-free; Fatigue; Low cycle fatigue; Solder joints; Bulk; Electronics;
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
Keywords: اتصالات جوش; Finite element analysis; Constitutive modeling; Strain gradient plasticity; Low cycle fatigue; Damage mechanics; Solder joints