Reliability of SnAgCuFe Solder Joints in WLCSP30 Device

Anand constitutive model of SnAgCuFe solder joints was studied, and 9 parameters were determined based on tensile testing. And the model was incorporated in finite element code for analyzing the stress-strain response of SnAgCuFe solder joints in WLCSP30 device. The results indicate that the maximum stress concentrates on the top surface of corner solder joints, and the stress-strain of SnAgCuFe solder joints is lower than that of SnAgCu solder joints. Based on the fatigue life model, the addition of Fe can enhance the fatigue life of SnAgCu solder joints. Therefore, the SnAgCuFe solders can replace the traditional SnPb to be used in electronic packaging