High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 83, April 2018, Pages 101-110

Asit Kumar Gain, Liangchi Zhang,