کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6945773 | 1450519 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The purpose of this paper is to measure and analyze the Sn-1Ag-0.5Cu solder joints under high speed ball impact test (BIT) conditions. In this study, the ball impact test was conducted at impact velocity of 300â¯mm/s on package-level solder joints with 0.3â¯mm ball diameter, bonded individually on substrate pads of Ni/Au, OSP and Ni/Pd/Au surface finishes at elevated temperature of 25, 50, 75, 100 and 125â¯Â°C, respectively. The experimental results show that Ni/Pd/Au surface finish at room temperature has higher intermetallic compound (IMC) strength performance than Ni/Au and OSP. These three different substrate surface finishes, however, tend to have quite similar IMC strength performance at elevated operation temperature. The board-level drop test reliability of TFBGA 14â¯mmâ¯Ãâ¯14â¯mm 409â¯L for these surface finishes were also performed at room temperature. The trends of BIT results are in good agreement to board-level drop test reliability. A three-dimensional finite element analysis (FEA) model was established to analyze the transient structural responses in the solder joint for determining the maximum impact toughness capacity. The effects of temperature on solder joint material yield stress and IMC strength on the impact characteristics were investigated.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 82, March 2018, Pages 204-212
Journal: Microelectronics Reliability - Volume 82, March 2018, Pages 204-212
نویسندگان
Chin-Li Kao, Tei-Chen Chen,